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FIB Lift-Out Grids and Grid Boxes
PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si
The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.
Copper PELCO® FIB Lift-Out Grid TEM Grids
The typical thickness of the copper lift-out grids is 35µm +/-5µm. The Cu FIB lift-out grids also have a thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Available with either one or two wider v-shaped posts or four narrow flat posts with identification number etch through. Use single or dual wider posts for attaching single lamellas or the four posts for attaching a larger number of lamellas. Size of wide post is 250 x 35 x 190µm (W x D x H), size of narrow post is 80 x 35 x 190µm (W x D x H). Sold in packs of 100. FIB grid with 2 wide posts available with thickness of 55µm ±5µm as well.
Molybdenum PELCO® FIB Lift-Out Grid TEM Grids
The typical thickness for the molybdenum lift-out grids is 50µm +/-5µm. Use Mo where Cu can’t be tolerated. Only available with two wide posts. Size of wide post is 250 x 50 x 190µm (W x D x H). Sold in packs of 25.
Silicon PELCO® FIB Lift-Out Grid TEM Grids
The thickness of the silicon lift-out grids is 100µm which makes them compatible with all standard TEM holders. Perfect half circular shape which fits nicely in the TEM grid holder. Debris-free, metal-free lift-out grids which readily bond with Pt to attach the lamellas. Straight edges, similar to the Cu and Mo grids; easy to handle. B-doped, conductive silicon minimizes charging during sample preparation and TEM imaging. Available with four narrow posts, which can be shaped if needed. Post size is 80 x 100 x 190µm (W x D x H). Sold in packs of 10.
The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Available in standard Cu with 3, 4 and 5 posts and in Mo With 3 and 4 posts. All Lift-Out Grids have multiple indexed mounting positions for easy identification and positioning in the TEM.
GSB-100 Storage Box for FIB Lift Out Grids
GSB-100 Storage Box for 100 FIB lift out grids or storing standard 3mm TEM grids flat.
No adhesive in tray (made from ABS). Cavity size is 3.34 x 3.34 x 1.5mm (0.13″ x 0.13″ x 0.06″). Complete with clear polystyrene lid and clear polypropylene clip. Stackable.
Overall size is 55 x 51 x 10.7mm (2.16″ x 2″ x 0.42″)
Anti-Static GSB-100 Storage Box for FIB Lift Out Grids
Same internal and external dimensions as standard GSB-100 storage box, but with anti-static tray made of black conductive polypropylene. Complete with anti-static cover and polypropylene clip. Stackable.
Overall size is 55 x 51 x 10.7mm (2.16″ x 2″ x 0.42″)
PELCO® FIB Grid Box for Lift-Out Grids or Half Grids
Four position grid box with lid for holding FIB lift-out grids or half grids. The PELCO® FIB Lift-Out Grid Box cavity depth is only 1.7mm, thus preventing the grids from rotating in the diamond shaped cavity. The FIB grids can be relatively easily loaded/unloaded using sharp tweezers.
PELCO® Silicon Aperture Frames
(without support film)
The PELCO® Silicon Aperture Frames are 3mm disk type frames with a thickness of 200µm and square or rectangular apertures. They are made with the same clean state-of -the-art manufacturing techniques as the PELCO® Silicon Nitride Support Films. The Silicon Nitride has been removed and leaves a silicon frame. They are perfectly round shaped 3mm frame featuring the Easygrip™ edge for easy handling. No broken edges and free of debris often associated with other manufacturing processes. Offered with three sizes of openings: 0.5 x 0.5, 1.0 x 1.0 and 1.5 x 0.5mm. Fully compatible will standard 3mm TEM holders.
- Support frame to attach TEM lamellas made with FIB, DualBeam® or CrossBeam® instruments for subsequent TEM imaging
- Easy access due to wide angle opening
- Protects TEM Lamella During Transport
